From: David Martin (firstname.lastname@example.org)
[Note: this announcement is essentially the same as recent postings on the HotDAML newsletter and on email@example.com. Most discussion regarding DAML-S takes place on firstname.lastname@example.org.] A new release, version 0.6, of DAML-S (DAML for Services) is available here: http://www.daml.org/services/. Version 0.6 includes a number of refinements to the Service Profile and Process Model. The Service Profile is used to concisely represent the service, in terms of capabilities, service provider information, and operational parameters (e.g. cost-of-use, quality- of-service parameters, etc), and advertise the service, with Web Service Registries or other service indexing schemes. Improvements over DAML-S 0.5 include: clarification and simplification of capability description parameters (i.e. inputs, outputs, preconditions and effects), and a tighter integration with the process model, as well as refinements necessary to facilitate automatic service discovery through Matchmaking. The process model provides a declarative description of the programs or processes that realize a Web service. In version 0.6, the process model has been modified to comprise three subclasses: AtomicProcess, SimpleProcess, and CompositeProcess, and some new properties have been added to characterize the relationships between processes of these different types. Among the other significant changes, the model allows for conditions on outputs and effects of all processes, and for computed inputs, outputs, effects, and preconditions associated with composite processes. It also includes a simplification of the representation of composite processes, that facilitates composite process encoding and manipulation. The services ontology includes three major subdivisions, those dealing with profiles, process models, and groundings. Looking further ahead, version 1.0 will be released when work underway on groundings and on execution modeling has been completed. We appreciate recent discussion and contributions on the www-ws mailing list related to groundings. David Martin, on behalf of the DAML-S contributors from BBN Technologies, Carnegie Mellon University, Nokia, Stanford University, SRI International, and Yale University.
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